Scientific Committee

  • W.G. Ahmadi, Clarkson Univ., Potsdam, New York
  • S.T. Ariaratnam, Univ. of Waterloo, Ontario, Canada
  • L.A. Bergman, Univ. of Illinois, Urbana-Champaign, Illinois
  • F. Casciati, Univ. of Pavia, Pavia, Italy
  • M.F Dimentberg, Worcester Polytechnic Inst., Worcester, Massachusetts
  • O. Ditlevsen, Technical Univ. of Denmark, Lyngby, Denmark
  • M. Grigoriu, Cornell Univ., Ithaca, New York
  • H.H Hilton, Univ. of Illinois, Urbana- Champaign, Illinois
  • M. Hoshiya, Musashi Inst. of Technology, Tokyo, Japan
  • R.N. Iyengar, Central Building Research Inst., Roorkee, India
  • A. Kareem, Univ. of Notre Dame, Notre Dame, Indiana
  • R. Khasminskii, Wayne State Univ., Detroit, Michigan
  • W. Kliemann, Iowa State Univ., Ames, Iowa
  • S. Krenk, Technical Univ. of Denmark, Lyngby, Denmark
  • Y.K. Lin, Florida Atlantic Univ., Boca Raton, Florida
  • G. Lindgren, Lund Univ., Lund, Sweden
  • S. Namachchivaya, Univ. of Illinois, Urbana- Champaign, Illinois
  • A. Naess, Norwegian Inst. of Technology, Trondheim, Norway
  • M. Noori, Worcester Polytechnic Inst., Worcester, Massachusetts
  • J.B. Roberts, Univ. of Sussex, Brighton, England
  • G.I Schuëller, Univ. of Innsbruck, Innsbruck, Austria
  • M. Shinozuka, Univ. of Southern California, Los Angeles, California
  • K. Sobczyk, Polish Academy of Sciences, Warsaw, Poland
  • T.T. Soong, State Univ. of New York, Buffalo, New York
  • B.F. Spencer, Jr., Univ. of Notre Dame, Notre Dame, Indiana
  • W.V. Wedig, Universitat Karlsruhe, Germany
  • Y.K. Wen, Univ. of Illinois, Urbana- Champaign, Illinois
  • W.Q. Zhu, Zhejiang University, Hangzhou, China